AG TERMOPASTY Lead-Free Solder Paste – Sn96.5Ag3Cu0.5, Syringe 6g
High-quality lead-free solder paste from AG TERMOPASTY, ideal for precision electronics soldering. Comes in a 6g syringe with halide-free, no-clean REL0 flux. Offers stable and reliable joints with Sn96.5Ag3Cu0.5 alloy composition and a grain size of 25–45µm.
Technical Specifications
- Manufacturer: AG TERMOPASTY
- Type: Solder paste
- Form: Paste
- Package: Syringe
- Alloy Composition: Sn96.5Ag3Cu0.5
- Grain Size: 25–45µm
- Binder Weight: 6g
- Melting Point: 217°C
- Flux Type: Halide-free, No Clean, REL0
- Flux Content: 12%
- Residues: Transparent, non-corrosive, do not require cleaning
- GHS Signal Word: Warning
- Hazard Statement: H317: May cause an allergic skin reaction.
- Version: For soft soldering
- Gross Weight: 23.1 g
Storage Instructions
Caution: Store at approximately 8°C to maintain paste quality.
Agent Features
- Lead-free composition
- Residues are non-corrosive and transparent
- Can be cleaned with alcohol-based agents if needed
- No cleaning required after soldering
Precautionary Statements
- P261: Avoid breathing dust/fume/gas/mist/vapours/spray.
- P280: Wear protective gloves/protective clothing/eye protection/face protection.
- P333 + P313: If skin irritation or rash occurs: Get medical advice/attention.
- P362: Take off contaminated clothing and wash before reuse.
- P501: Dispose of contents/container in accordance with local regulations.
GHS Classification
- GHS07: Skin sensitisation, eye irritation, acute toxicity
- GHS01–GHS09: Not applicable to this product (standard hazard classes listed for reference)