Tulkot latviski
Silicone encapsulating compound | white | 110g | -50÷200°C | 20kV/mm
Silicone encapsulating compound | white | 110g | -50÷200°C | 20kV/mm
EB Kods: EB739405379
Ražotāja preces kods: ART.AGT-220
Ražotāja preces kods:
ART.AGT-220
Ražotājs, zīmols: AG TERMOPASTY
Ražotājs, zīmols:
AG TERMOPASTY
15,36 €
Ar PVN / gb
Pieejams piegādātāja noliktavā >10 gab.
⛟ Piegāde 1-3 darba dienas pēc apmaksas.
⛟ Piegāde 1-3 darba dienas pēc apmaksas.
Type of chemical agent | silicone encapsulating compound |
Colour | white |
Application | sealing and encapsulation of electronic circuits |
Shore hardness | 59 |
Operating temperature | -50...200°C |
Thermal conductivity | 1.2W/mK |
Density | 1.2g/cm3 @ 25°C |
Mix ratio | 100:10 |
Dielectric constant | 3 |
Appearance | paste |
Available labels languages | BG |
Available labels languages | CZ |
Available labels languages | DE |
Available labels languages | EN |
Available labels languages | FI |
Available labels languages | FR |
Available labels languages | HU |
Available labels languages | PL |
Available labels languages | RO |
Available labels languages | RU |
Available labels languages | SK |
Surface resistance | <2410TΩ |
Agent features | condensation cure |
Agent features | two-component |
Curing method | RTV |
Net weight | 110g |
Bonding time | 30min |
Dielectric strength | 20kV/mm |