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Теплопроводная силиконовая паста | 0.88 Вт/мК | 100г AG AGT-057

EB Код: CHE1411

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Thermal Conductive Paste H

Thermal Conductive Paste H

Your solution for heat conduction (0.88 W/mK) with excellent protection

In today's world, where electronics are becoming increasingly advanced and devices operate under greater stress, effective heat dissipation becomes crucial. Thermal Conductive Paste H is a product that provides exceptional thermal conductivity above 0.88 W/mK, ensuring optimal cooling for your devices.

Why Thermal Conductive Paste H?

Our paste is specifically designed to:

  • Facilitate heat flow between electronic components and the heat sink.
  • Protect temperature sensors from environmental influences and prevent breakdowns.
  • Offer excellent chemical resistance to oxidation, acids, alkalis, salts, sulfur dioxide, and ammonia.
  • Be highly resistant to electric current for increased safety.

Wide Application

Wide Range of Uses:

  • Modules with high heat conduction coefficients
  • Cooling devices
  • Storage drives
  • Motor control systems
  • Power converters
  • High-power LEDs
  • Laptops, computers, and network communication devices
  • Home appliances
  • Electronic and electrical components
  • Air conditioners

Thermal Conductive Paste H operates smoothly from -50°C to 250°C and has a density of 2.58 g/cm3.

How to Use Thermal Conductive Paste H?

The paste is chemically inert and can be safely applied to plastic surfaces. Apply a thin layer to a cleaned surface and spread evenly with a spatula.

Summary

Thermal Conductive Paste H is more than just a heat conductor. It is essential for optimizing the performance and reliability of your electronic devices. Whether you are a professional, hobbyist, or innovator, this paste is a key element for your projects. Choose Thermal Conductive Paste H and experience the difference!