Tulkot latviski
Board: universal | single sided,prototyping | W: 60mm | L: 100mm
Board: universal | single sided,prototyping | W: 60mm | L: 100mm
EB Kods: EB1157057051
8,98 €
Ar PVN / gb
Pieejams piegādātāja noliktavā >10 gab.
⛟ Piegāde 1-3 darba dienas pēc apmaksas.
⛟ Piegāde 1-3 darba dienas pēc apmaksas.
Type of board | universal |
Board variant | prototyping |
Board variant | single sided |
Material | epoxy resin |
Material | FR4 |
Laminate thickness | 1mm |
Width | 60mm |
Length | 0.1m |
Copper plating thickness | 18µm |
Hole diameter | 1mm |
Soldering pads configuration | 0805 |
Soldering pads configuration | 1206 |
Soldering pads configuration | DIP4 |
Soldering pads configuration | DIP6 |
Soldering pads configuration | DIP8 |
Soldering pads configuration | DIP10 |
Soldering pads configuration | DIP12 |
Soldering pads configuration | DIP14 |
Soldering pads configuration | DIP16 |
Soldering pads configuration | DIP18 |
Soldering pads configuration | DIP20 |
Soldering pads configuration | DIP22 |
Soldering pads configuration | DIP24 |
Soldering pads configuration | DIP28 |
Soldering pads configuration | MELF |
Soldering pads configuration | SMA |
Soldering pads configuration | SMB |
Soldering pads configuration | SMC |
Soldering pads configuration | SO8 |
Soldering pads configuration | SO10 |
Soldering pads configuration | SO14 |
Soldering pads configuration | SO16 |
Soldering pads configuration | SO18 |
Soldering pads configuration | SO20 |
Soldering pads configuration | SO24 |
Soldering pads configuration | SO28 |
Soldering pads configuration | SOD80 |
Soldering pads configuration | SOD87 |
Soldering pads configuration | SOT23 |
Soldering pads configuration | SOT89 |
Soldering pads configuration | SOT143 |
Soldering pads configuration | SOT223 |
Soldering pads configuration | SOT323 |
Soldering pads pitch | 0.7/2.54mm |
Kind of material | fiber glass reinforced |