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Silicone encapsulating compound | grey | 110g | -50÷200°C | 20kV/mm
Silicone encapsulating compound | grey | 110g | -50÷200°C | 20kV/mm
EB Koodi: EB1068020494
Valmistajan tuotekoodi: ART.AGT-221
Valmistajan tuotekoodi:
ART.AGT-221
Valmistaja, merkki: AG TERMOPASTY
Valmistaja, merkki:
AG TERMOPASTY
15,41 €
Sisältää arvonlisäveron / gb
Toimittajan varastossa >10 kpl
⛟ Toimitus 1-3 työpäivää maksun jälkeen.
⛟ Toimitus 1-3 työpäivää maksun jälkeen.
| Type of chemical agent | silicone encapsulating compound |
| Colour | grey |
| Application | sealing and encapsulation of electronic circuits |
| Shore hardness | 67 |
| Operating temperature | -50...200°C |
| Thermal conductivity | 2W/mK |
| Density | 1.08g/cm3 @ 25°C |
| Mix ratio | 100:10 |
| Dielectric constant | 3 |
| Appearance | paste |
| Available labels languages | BG |
| Available labels languages | CZ |
| Available labels languages | DE |
| Available labels languages | EN |
| Available labels languages | FI |
| Available labels languages | FR |
| Available labels languages | HU |
| Available labels languages | PL |
| Available labels languages | RO |
| Available labels languages | RU |
| Available labels languages | SK |
| Surface resistance | <1750TΩ |
| Agent features | condensation cure |
| Agent features | two-component |
| Curing method | RTV |
| Net weight | 110g |
| Bonding time | 30min |
| Dielectric strength | 20kV/mm |